Tray AFVI | PIXEL

Tray AFVI Automated Unit-Level Visual Inspection System

Unit-Level Final Visual Inspection

High-Resolution Color & Dent InspectionTray AFVI

Precision inspection of fine visual defects in FC-BGA units loaded in JEDEC trays.

Designed for unit-level final visual inspection of FC-BGA package substrates loaded in JEDEC trays.

Features 2.5–5 µm/pixel color inspection optics, with optional Dent inspection capabilities.

Supports automated double-sided inspection configurations to improve operational efficiency and ease of use in unit-level inspection processes.

Product type

Unit on JEDEC Tray

FC-BGA unit inspection centered on tray loading

Loading capacity

Max. 150 Tray

2D configuration with auto flip and one-side 3D configuration offered separately

Product inquiry

Tray AFVI product specifications

Color Unit 2D AFVI

U-400T

A 2D color inspection model designed for FC-BGA units loaded in JEDEC trays, supporting automated double-sided inspection with Auto Flip. A tray loading capacity of up to 150 trays supports continuous inspection operation.

Color: 2.5-5 um/pixel
Metal / SR
Max. 150 tray at once
System size: 2,330(W) x 1,780(D) x 1,965(H) mm

Multi-angle white LED
25 sec/tray
Dual-side auto flip

3D Height Inspection

U3D-400T

A tray-based, single-sided 3D height inspection model designed to precisely measure and inspect height values and height variations of individual units.

X: 6.5 um, Z: 20 nm
FOV: 11.6 mm
35 sec/tray
System size: 1,960(W) x 1,510(D) x 2,105(H) mm

Z-repeatability: 200 nm
Range: 350 um to 500 um
Unit on JEDEC tray, one side

Model Selection Criteria

Tray AFVI Selection Guide

Choose U-400T for automated double-sided 2D color inspection using JEDEC trays.
Consider U3D-400T for bump height measurement and height variation inspection.
Tray-in / Tray-out handling configurations can be reviewed based on production requirements.
IVS / ICS integration enables defect review and verification workflows.

System Configuration

Inspection & Handling Configuration

U-400T supports automated double-sided inspection with Auto Flip using JEDEC trays.
2D color optics enable visual defect inspection of Metal and solder resist (SR) areas.
U3D-400T uses 3D height measurement for bump height and height variation inspection.
Warpage measurement capabilities are subject to separate evaluation based on inspection range and accuracy requirements.

Model Selection Criteria

Tray AFVI Selection Guide

Choose U-400T for automated double-sided 2D color inspection using JEDEC trays.
Consider U3D-400T for bump height measurement and height variation inspection.
Tray-in / Tray-out handling configurations can be reviewed based on production requirements.
IVS / ICS integration enables defect review and verification workflows.

System Configuration

Inspection & Handling Configuration

U-400T supports automated double-sided inspection with Auto Flip using JEDEC trays.
2D color optics enable visual defect inspection of Metal and solder resist (SR) areas.
U3D-400T uses 3D height measurement for bump height and height variation inspection.
Warpage measurement capabilities are subject to separate evaluation based on inspection range and accuracy requirements.