Combining high-resolution color imaging with specialized optical technologies, PIXEL supports precision inspection of visual defects, ABF voids, SR pinholes, and other key defects at the Panel and Quad levels.
Designed for final visual inspection of FC-BGA and FC-CSP package substrates at the Strip level, supporting Stack and Magazine handling configurations with automated double-sided inspection.
Designed for unit-level final visual inspection of FC-BGA package substrates using JEDEC trays, supporting high-resolution color inspection and automated double-sided inspection configurations.
An integrated verification solution combining AI-based defect filtering, IVS image review, and ICS high-magnification reinspection to reduce false-positive review workloads and improve final decision reliability.
Centralizes the management of CAM data, NAS-stored files, and inspection specification databases, enabling recipe sharing and deployment across inspection systems of the same model to improve setup and operational efficiency.
UV-induced fluorescence enables clearer detection of dry film resist (DFR) residues that are difficult to distinguish in conventional color images.
Infrared (IR) imaging enhances the visibility of circuit patterns beneath the solder resist (SR) layer, supporting the detection of open and short defects that are difficult to identify with conventional color imaging.
Specialized optics and illumination enhance the visibility of subtle surface dents that are difficult to identify in conventional color images, enabling more reliable defect detection.
Color imaging provides clearer differentiation of color and material characteristics that are difficult to distinguish in monochrome images, supporting defect classification, operator review, and AI-based inspection.
