Precision inspection of fine visual defects in FC-BGA and FC-CSP package substrates at the Strip stage.
Designed for final visual inspection of FC-BGA and FC-CSP package substrates at the Strip level.
Supports optional 1 µm-class high-resolution color inspection and Dent inspection configurations.
Supports Stack and Magazine handling methods with automated double-sided inspection configurations to improve operational efficiency.
Resolution range
1-5 um/pixel
From high-resolution to color and dent inspection—replaces visual inspection on a single platform
Loading method
Magazine + Stack
Supports magazine and single-unit loading with dual-side automatic inspection
An advanced Strip AFVI model combining 1 µm/pixel high-resolution color imaging with dedicated Dent inspection optics for precise detection of fine visual defects and surface dents.
A color inspection model designed for FC-BGA and FC-CSP package substrates at the Strip stage, providing precise visual inspection of Metal and solder resist (SR) areas.
An AFVI model designed to inspect metal and solder resist (SR) areas of Direct Copper Bonded (DCB) substrates used in power semiconductor modules. It supports double-sided visual inspection with multi-angle, multi-wavelength illumination, Strip Stack handling, and automatic flipping.
