Early defect detection at intermediate panel-level production stages supports effective quality control.
High-resolution color inspection serves as the foundation, with support for specialized UV, IR, and Dent inspection configurations.
Optical systems and inspection parameters can be tailored to post-SR, post-ABF, post-VHP, and post-CZ process requirements.
Early defect detection at the panel stage helps reduce the risk of defective substrates entering downstream processes and improves quality control efficiency.
Product highlights
Resolution range
2-5 Um/Pixel
Multi-wavelength support: Color, UV, IR
Applicable processes
ABF / PSR / CZ / VHP
Automation support for FOUP, Tray, Box
A high-resolution color inspection model designed for post-PSR processes, featuring automatic panel flipping for double-sided inspection and Panel-in-Tray handling.
A multi-optical inspection model combining color imaging and UV fluorescence-based inspection to detect and distinguish defects such as dry film resist (DFR) residue after the CZ process.
A multi-optical inspection model combining color and infrared (IR) imaging for post-PSR inspection, designed to detect defects such as shorts beneath the solder resist (SR), pattern opens/shorts, and exposed copper.
A manually operated color inspection model designed for single-sided panel inspection after the PSR process, utilizing high-resolution optical imaging and multi-angle white LED illumination to detect visual defects.
