AI Integrated Inspection Platform

Inspection Intelligence For Yield DecisionsaFrom Detection to Decision

From Color Inspection to Final Decision, One Integrated Inspection Platform

By connecting Panel, Strip, and Tray inspection systems with AI inspection and filtering, IVS/ICS verification, and Pixel Master recipe management, PIXEL helps improve defect detection performance and decision-making efficiency in high-volume production.

Product portfolio

Core products for production lines

Business areas

Precision Visual Inspection for FC-BGA Substrates, Glass PCBs, and Wafers

PIXEL combines precision optics, AI inspection and filtering, and IVS/ICS verification systems to deliver visual inspection solutions tailored to specific products and process requirements.

Advanced Package Substrate Inspection

FC-BGA Substrate

Precision inspection of fine visual defects in solder resist (SR) and metal pattern areas across Panel, Strip, and Unit stages of FC-BGA package substrates used in AI servers and high-performance computing (HPC) applications.

FC-BGA Substrate

Advanced Glass Substrate Inspection

Glass Substrate

Optical systems and image processing technologies tailored to glass substrates enable precision inspection of key visual defects, including via holes and cracks, in next-generation semiconductor packaging.

Glass Substrate

Precision Wafer Surface Inspection

Wafer

High-resolution optical imaging enables precise inspection of surface anomalies and fine visual defects on wafers used in advanced semiconductor manufacturing processes.

Wafer

We see inspection equipment not as isolated machines
but as one operating system.

From optics, precision mechanics, control, and inspection systems to defect data management, AI inspection and filtering, and verify — unified on one platform for mass-production performance and operability.
1

Panel / Strip / Tray Scan

Combine Color, UV, IR, Dent optics per processto secure defect detection data.

2

AI Inspection andFiltering Integration

AI inspection for critical areas and OK/NG defect filteringto improve detection and reduce operator review load.

3

IVS / ICS non-contact verify

Image-based verify and precision re-imagingto improve final OK / NG accuracy.

Key metrics from field deployment

0
Founded
Inspection equipment and AI solutions company based in Pyeongtaek
0
Employees
Korea 47, India 7
1-5 Um
Resolution
Coverage across Panel / Strip / Tray product lines
Asia
Footprint
Installations in Korea, Japan, Taiwan, Vietnam, Singapore

Business areas

Industries and process scope

From FC-BGA Substrate and Semi-Conductor
to final inspection and non-contact verify.

Stepwise expansion across semiconductor inspection and verify

PCBSemi-ConductorSubstratePackageFC-BGAGlass PCBMiddle InspectionFinal InspectionAI InspectionAI FilteringNon-Contact Verify
  • Dedicated mechanics and optics per Panel, Quad, Strip, and Unit process
  • Rule-based inspection, AI, and operator verify tailored to customer lines
  • Projects propose the full operating system, not equipment alone

New inspection lines, false-call reduction,
and verify automation — let's discuss together.

Leave a message about products, processes, or collaboration and our team will follow up.